Effects of short-term annealing on the thermal stability and microstructural evolution of oxygen-free copper processed by high-pressure torsion.

Abstract

This study explores the impact of short-term annealing on the thermal stability and mechanical properties of oxygen-free copper subjected to high-pressure torsion (HPT). Copper samples were deformed through HPT with varying numbers of turns at room temperature and subsequently subjected to short-term annealing at temperatures of 398 K and 423 K. Microstructural analysis revealed that annealing led to grain growth and a reduction in dislocation density, with samples processed with fewer HPT turns exhibiting more significant grain coarsening. The microhardness measurements indicated a reduction in hardness after annealing, particularly at the edges of the discs, suggesting recrystallization. Samples processed with 10 HPT turns demonstrated higher thermal stability and less grain growth compared to 1/2-turn samples. The findings suggest that post-HPT short-term annealing can be used to tailor the balance between strength and ductility in oxygen-free copper, enhancing its suitability for industrial applications.