Tactile whole-field imaging sensor on photoelasticity.

Dubey, V. N. and Grewal, G. S., 2007. Tactile whole-field imaging sensor on photoelasticity. In: ASME International Design Engineering Technical Conference, 4-7 September 2007, Las Vegas, Nevada, USA, pp. 339-345.

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Abstract

The paper describes a whole-field imaging sensor developed on the principles of photoelasticity. The sensor produces colored fringe patterns when load is applied on the contacting surface. These fringes can be analyzed using conventional photoelastic techniques, however, as the loading in the present case is not conventional some new strategies need to be devised to analyze the load imprint. The loading is unconventional in the sense that low modulus photoelastic material is deformed under vertical load in the direction of light travel to induce the photoelastic effect. The paper discusses the efficacy of both RGB calibration and phase shifting techniques in sensing applications. The characteristics of fringe patterns obtained under vertical and shear loads have been studied and the results obtained under these conditions are discussed with their limitations specifically when this is applied for sensing applications. Finally a case study has been conducted to analyze a foot image and conclusions drawn from this have been presented. Copyright © 2007 by ASME.

Item Type:Conference or Workshop Item (Paper)
Additional Information:2007 Proceedings of the ASME International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, DETC2007 4, pp. 339-345
Uncontrolled Keywords:Phase unwrapping; Photoelasticity; RGB methods; Unconventional loading; Whole-field sensor
Subjects:Technology > Engineering > General Engineering
Group:School of Design, Engineering & Computing > Smart Technology Research Centre
ID Code:10716
Deposited By:Dr Venky Dubey
Deposited On:16 Sep 2009 20:56
Last Modified:07 Mar 2013 15:11

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