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Comparisons of self-annealing behaviour of HPT-processed high purity Cu and a Pb–Sn alloy.

Huang, Y., Sabbaghianrad, S., Almazrouee, A.I., Al-Fadhalah, K.J., Alhajeri, S.N., Zhang, N.X. and Langdon, T.G., 2017. Comparisons of self-annealing behaviour of HPT-processed high purity Cu and a Pb–Sn alloy. Journal of Materials Research and Technology, 6 (4), 390 - 395.

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DOI: 10.1016/j.jmrt.2017.07.002

Abstract

Early published results have demonstrated that high purity Cu and a Pb–62% Sn alloy exhibit very different behaviour during high-pressure torsion (HPT) processing at room temperature and subsequent room temperature storage. High purity Cu showed strain hardening behaviour with a refined grain structure during HPT processing whereas a Pb–62% Sn alloy displayed a strain weakening behaviour because the hardness values after HPT processing were significantly lower than in the initial as-cast condition even though the grain size was reduced. During room temperature storage after HPT processing, high purity Cu with lower numbers of rotations softened with the time of storage due to local recrystallization and abnormal grain growth whereas the Pb–62% Sn alloy hardened with the time of storage accompanied by grain growth. Through comparisons and analysis, it is shown that the low absolute melting point and the high homologous temperature at room temperature in the Pb–62% Sn alloy contribute to the increase in hardness with coarsening grain size during room temperature storage.

Item Type:Article
ISSN:2238-7854
Additional Information:Paper delivered at the 3rd Pan American Materials Congress, February 26th to March 2nd, 2017.
Uncontrolled Keywords:high-pressure torsion; high purity Cu; Pb–62%Sn alloy; self-annealing
Group:Faculty of Science & Technology
ID Code:34364
Deposited By: Unnamed user with email symplectic@symplectic
Deposited On:03 Aug 2020 11:21
Last Modified:03 Aug 2020 11:21

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